STANDBY COOLING SUPPLY IN COMPUTING FACILITIES

Techniques for providing standby cooling capacity to electronic components are disclosed herein. In one embodiment, a method includes receiving, via an air inlet of an enclosure, incoming air at a temperature that is equal to or above a melting point of a phase change material in a heat exchanger proximate to the air inlet. The method then includes reducing the temperature of the incoming air by removing heat from the incoming air to the phase change material when the incoming air flows past the heat exchanger, thereby triggering a phase transition in the phase change material from solid to liquid. The method further includes supplying the incoming air with the reduced incoming temperature to the multiple servers in the internal space of the enclosure, thereby providing cooling to the multiple servers in the internal space of the enclosure.